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Bench Top Thermal Imaging Camera Kit
TRODEKS Engineering | Thermocouples, Pressure Transducers, Flow Meters, PID Controllers
  • For sales outside of the US and Canada
    Please order from our European Websites Directly.
  • Designed Specifically for Thermal Benchtop Testing Applications
  • Compact, Rugged, and Lightweight
  • Plug-and-Play Compatibility
  • Fast Data Transfer
  • Includes Everything Needed for Quick “Out of Box” Deployment
  • Compliant with Any Software that Supports GenICamTM, Including National Instruments IMAQ Vision, Stemmers
  • Common Vision Blox, and COGNEX Vision Pro
  • GigE VisionTM Standard Compatibility
  • GenICamTM Protocol Support
  • PoE (Power Over Ethernet)
  • GPIO (General Purpose Input/Output)
  • Wide Temperature Range
  • High Sensitivity <50 mK
 Manuals (contact with email : [email protected])


Thermal imaging cameras can beused for a wide variety of R&Dapplications. Until today usinga thermal imaging camera wasoften the privilege for large R&Ddepartments. With the extremelyaffordable OSXL-A35SC/OSXL-A15SC and OSXL-A5SCthermal imaging systems arenow bringing the advantages ofthermal imaging to the test benchof every R&D engineer.
The OSXL-A35SC/OSXL-A15SC andOSXL-A5SC models are not onlyextremely affordable, theycontain both the hardware andsoftware for analyzing andverifying your R&D projects.You will be able to visualizeand measure temperatures ina non-contact mode.
The OSXL-A35SC produces crispthermal images of 320 x 256pixels. Users that do not needthis high image quality for theirapplication can choose theOSXL-A15SC which producesthermal images of 160 x 128pixels or the OSXL-A5SCwhich produces thermal imagesof 80 x 64 pixels.
The OSXL-A35SC, OSXL-A15SC,and OSXL-SC5 are affordableinfrared camera kits designedspecificallyfor thermal benchtoptesting applications. The compactpackaging makes the OSXL-A5SCa perfect fitfor the benchtop andallows for deployment in locationswhere size constraints are critical.They are available in a variety ofpixel resolutions and can meet thespatial resolution requirements ofmost applications.
Eliminate the guesswork, see heatpatterns with the thermal imageryand extract temperature valuesfrom live or recorded imagery.This instrument has uncooledmicro bolometer detector that ismaintenance-free and providesexcellent long wave imagingperformance. The pixel resolutionand optics are available in 80 x64, 160 x 128, 320 x 256 pixelformats to achieve numerous fieldsof view. Versatile, compact,rugged, and lightweight withstraightforward mounting thatpermits quick installation and easymovement for new applicationrequirements. Plug-and-playcompatibility, is an ideal systemintegration solution through GigEVision and GenICam protocols,these cameras can be fullyconfiguredfrom a PC, allowingcamera control and image capturein real time. Fast data transfer andRJ45 GB Ethernet connectionsupply 14-bit images at framerates as high as 60 Hz. Imageand data acquisition can recordthermal snapshots and movieswith OSXL-ASC tools + recordingand analysis software.
GigE Vision® is a new camerainterface standard developedusing the Gigabit Ethernetcommunicationprotocol. GigEVision is the first standard videointerface to allow for fast imagetransfer using low cost standardcables even over long distances.With GigE Vision, hardware andsoftware from different vendorscan interoperateseamlessly overGigE connections.
The goal of GenICamTM is toprovide a generic programminginterface for all types of cameras.Regardless of interface technology(GigE Vision, Camera Link®,1394 DCAM, etc.) or featuresimplemented, the ApplicationProgrammingInterface (API)will always be the same.The GenICam protocol alsomakes it possible to use thirdparty software with thecamera. GenICam makes theOSXL-A35SC plug-and-play whenused with software packages suchas IMAQ Vision and Halcon.

IR Resolution:
    OSXL-A5SC: 320 x 256 pixels
    OSXL-A15SC: 160 x 128 pixels
    OSXL-A35SC: 80 x 64 pixels
FOV (Field of View)/Focal Length:
    OSXL-A5SC/OSXL-A15SC: 48° (H) x 39° (V) with 9 mm lens
    OSXL-A35SC: 44° (H) x 36° (V) with 5 mm lens
Spatial Resolution (IFOV):
    OSXL-A5SC: 2.78 mrad for 9 mm lens
    OSXL-A15SC: 5.56 mrad for 9 mm lens
    OSXL-A35SC: 0.0 mrad for 5 mm lens
Detector Pitch:
    OSXL-A5SC: 25 µm
    OSXL-A15SC/OSXL-A35SC: 50 µm
Thermal Sensitivity/NETD: <0.05°C @ 30°C (86°F)/50 mK
Minimum Focus Distance: Fixed
F-Number: 1.25
Image Frequency: 60 Hz
Focus: Fixed
Focal Plane Array (FPA) Spectral Range: Uncooled VOX micro bolometer/7.5 to 13 µm
Detector Time Constant: Typical 12 ms
Object Temperature Range: -40 to 160°C (-40 to 320°F)/ -40 to 550°C (-40 to 1022°F)
Accuracy: ±5°C or ±5% of reading
Ethernet: Control and image
    Type: Gigabit Ethernet
    Standard: IEEE 802.3
    Connector Type: RJ45
    Communication: GigE Vision version 1.2; Client API GenICam compliant
    Image Streaming: 14-bit signal linear/DDE, GigE Vision and GenICam compatible
    Power: Power over Ethernet, PoE IEEE 802.3af class 0 power
    Protocols: TCP, UDP, ICMP, IGMP, DHCP, GigEVision
Digital Input/Output:
    Input: General purpose; 1× optoisolated, “0” < 2, “1” = 2 to 40 Vdc
    Output: General purpose output to external device (programmatically set); 1× opto-isolated, 2 to 40 Vdc, maximum 185 mA
Digital I/O:
    Isolation Voltage: 500 VRMS
    Supply Voltage: 2 to 40 Vdc, maximum 200 mA
    Connector Type: 12-pole M12 connector (shared with digital synchronization and external power)
Digital Synchronization:
    In: Frame sync into control camera; 1×, non-isolated; LVC buffer @3.3V, “0” <0.8 V, “1” >2.0 V
    Out: Frame sync out to control another Ax5 camera; 1×, non-isolated; LVC buffer @ 3.3V, ”0” = 24 MA maximum, “1” = -24 mA maximum
    Connector Type: 12-pole M12 connector (shared with digital I/O and external power)
External Power: 12/24 Vdc, <2.5 W absolute maximum
    Connector Type: 12-pole M12 connector (shared with digital I/O and digital synchronization)
    Voltage: Allowed range 10 to 30 Vdc
Operating Temperature Range: -15 to 50°C (5 to 122°F)
Storage Temperature Range: -40 to 70°C (-40 to 158°F)
Operating and Storage Humidity: IEC 60068-2-30/24 h 95% relative humidity, 25 to 40°C (77 to 104°F) EMC: EN 61000-6-2 (immunity), EN 61000-6-3 (emission), FCC 47 CFR Part 15 Class B (emission)
Encapsulation: IP 40 (IEC 60529)
Bump: 25 g (IEC 60068-2-29)
Vibration: 2 g (IEC 60068-2-6)
Weight: 0.2 kg (0.44 lb)
Dimensions: 106 L x 40 W x 43 mm H (4.2 x 1.6 x 1.7")
Tripod Mounting: Optional with accessory T198349, base support
Base Mounting: 4 × M3 thread mounting holes (bottom)
Housing Material: Magnesium and aluminum
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